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High temperature capacitors and transient liquid phase interconnects for Pb-solder replacement

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Abstract

Downhole oil and gas exploration, as well as military electronics have been the main markets for high temperature electronics above 150 °C. However, the use of wide band gap semiconductors, SiC and GaN, in power supplies and automotive applications, in addition to LED lighting, is increasing. These changes are driving the demand for improved capacitors and interconnect materials for packaging these. The development of high temperature multilayer ceramic capacitors (MLCC) with nickel inner electrodes is reviewed and recent developments highlighted. The application and properties of transient liquid phase sintered TLPS metal interconnects to replace solders in leaded MLCC are described in detail. The maximum shear stress capability of TLPS Cu–Sn and In–Ag surpasses Pb-based solders at higher temperatures up to 300 °C, so they are excellent candidates to replace Pb-based solders in future high temperature electronics.

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Acknowledgments

The authors would like to thank Javaid Qazi, Jim Magee, Lonnie Jones, Ken Holcomb Michael Matthews, Garry Renner, Jeff Bell and Jeff Murrell for their contributions with respect to developing and analyzing the TLPS technology.

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Authors and Affiliations

  1. KEMET Electronics Corporation, 2835 KEMET Way, Simpsonville, SC, 29681, USA

    John Bultitude & John McConnell

  2. Ormet Circuits, Inc., 6555 Nancy Ridge Drive, Suite 200, San Diego, CA, 92121, USA

    Catherine Shearer

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  1. John Bultitude
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  2. John McConnell
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  3. Catherine Shearer
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Correspondence to John Bultitude.

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Bultitude, J., McConnell, J. & Shearer, C. High temperature capacitors and transient liquid phase interconnects for Pb-solder replacement. J Mater Sci: Mater Electron 26, 9236–9242 (2015). https://doi.org/10.1007/s10854-015-3779-4

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  • DOI: https://doi.org/10.1007/s10854-015-3779-4

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